Zhejiang Gpilot Technology Co., Ltd

1. Copper Bonding WireCopper bonding wire is used as a material connecting a silicon die to the package terminals in semiconductor encapsulation.?As the increasing of the gold expense,Website:http://www.gpilot-bondingwire.com, copper bonding wire enjoys great cost advantage over gold wire. Additionally, due to the stable chemical properties and the high reliability of the bonding joint, copper wires are both technically and economically an attractive alternative to gold wires.2. Mechanical Properties3. Physical Properties?4. Application

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